LEI 1500 Series with Version 3.0 LEI Software

Windows NT 4.0 Operating System

• Improved stability
• Improved security / Passwords
• Ability to migrate to Windows 2000 & XP

Ethernet capability

• Ability to transfer / back-up test data to off-tool location
• Ability to monitor large test data for monthly trends and SPC
• Ability for process engineer to analyze test data real time

Improved Mapping capability

Allows:

• Printing maps in color or B/W
• Rotation of map
• Export Map & Summary as *.jpg for easy sharing of data or presentation use
• Ability to migrate to HTML format in future
   

Automated Calibration

• Eliminates random "noise spikes" that could create calibration errors
• Minimizes operator involvement
• Eliminates error in selecting calibration wafer

Improved "Rail Cal" Calibration

• Eliminates affect of magnetic changes of rails during tool lifetime
• Eliminates random "noise spikes" that could create calibration errors

LEI Tool Options:

GEM / SECS capability

• Allows tool to be run remotely

Off Line Data Analysis

• Allows process engineers to analyze test data at desk

Light Shield

• Available for all models to eliminate UV radiation during testing

Bar Code Reader

• Allows wafer ID input via bar code

Wafer Scanning

• Allows robot to automatically detect wafer locations on each cassette for automatic operation

Thin Film Thickness Option

Allows film thickness of conductive film to be displayed, based on known resistivity of film that is measured.

Robotic Wafer Sorting

• Ability to sort wafer and place in different cassettes ö Requires RS Model

Statistical Process Control

• Generates SPC charts and details on cassettes of 25 wafers

Temperature Compensation

• Corrects the sheet resistance to 23 C for Si wafers and corrects to 23 C on compound semiconductors with customer provided temperature coefficient