Non-Destructive Mobility System

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LEI's contactless mobility system eliminates the need for time-consuming sample preparation, and permits characterization of actual product wafers.

Applications
-Compound semiconductors

Measurement parameters
-Mobility
-Sheet resistance
-Sheet charge

System features
-Computerized control and data
 logging routines for calibration,
 linearization and standards fitting
-Typical range of capability from 500
 to 20,000 cm²/V-s
-Designed to utilize many existing
 magnetic and cryogenic
 configurations