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The ASTM International F1.15 Compound Wafer Subcommittee, of which I am happy to be the Chairperson, has three very active Task Groups that may be
helpful and we encourage you to join us. If that isn't possible,perhaps by your reading our Practice and Guide Drafts and giving us your feedback, we may help the industry improve.We have a combined Task
GroupTeleconference every month. We'd like to include you and your colleagues and customers. The three Task Groups and their leaders and activities are as follows: The Backside Processing Task Group
led by Dr. Maria Huffman ofAgilent Technologies in Santa Rosa, CA. and is looking for
inputs on their Backside Processing Practice Draft. You and your colleagues can get a copy by emailing Scott Orthey at ASTM.
The Backside Processing Metrology Task Group
led by Tom Parsons ofINSACO, Inc.
in Quakertown,PA. The final version of the Guide Draft will be available shortly and should be available by using the same procedure above and requesting it. Our Mobility Round Robin Task Group
led by Danh Nguyen of Lehighton Electronics, Inc. is conducting a pHEMT Mobility Round
Robin using both destructive and non-destructive measurement techniques. These tests are being conducted on both thin- and thick-cap wafers. |
