Model 1510RP Measurement and Mapping Systems
		Contactless Bulk Resistivity/Sheet Resistance/Capacitance Thickness Characterization of • All compound semiconductor materials (epi, annealed ion-implants on semi insulating and some doped substrates) • Silicon wafers (bulk Si, epi, annealed ion-implants, and POCl3 doping uniformity on high resistivity substrates) • Thin film metallization (Contact factory for details) Measurement Capabilities • Sample thickness range of 450 to 800 microns • Normal coil gap (>/= .035”/.889mm) • Robotic handling of 2” (50mm) to 8” (200mm) wafers Download brochure