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Model RS300 100mm - 300mm Silicon Contactless Bulk Resistivity/Sheet Resistance/Capacitance Thickness Features • GaAs wafers (epi, annealed ion-implants on semi-insulating and some doped* substrates) • Non-destructive characterization of 100mm to 300mm Si wafers • GEM/SECSII compliance • LEI Windows NT Software (standard) • HERMOS available -Bar-code scanning availability -Scanning end effector Download the brochure
Contactless Bulk Resistivity/Sheet Resistance/Capacitance Thickness Features • GaAs wafers (epi, annealed ion-implants on semi-insulating and some doped* substrates) • Non-destructive characterization of 100mm to 300mm Si wafers • GEM/SECSII compliance • LEI Windows NT Software (standard) • HERMOS available -Bar-code scanning availability -Scanning end effector
Download the brochure
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